The American semi-conductor company, Qualcomm, introduced its flagship Snapdragon 8 Elite chip (SM8750-AB) back in the month of October 2024 and many flagships have already been unveiled with this processor onboard with a few still on their way. Now, it has been revealed that apart from the 8-core architecture version (4.32 GHz primary clock speed) and the over-clocked version (4.47 GHz primary clock speed), the Snapdragon 8 Elite also has a version with 7-core architecture.

Here’s more about it.

Snapdragon 8 Elite – 7-Core or Hexa-Core Version Also Available

This 7-core architecture version of the Snapdragon 8 Elite chip has the model number – ‘SM-8750-3-AB’, featuring two prime cores clocked at 4.32 GHz and 5 performance cores clocked at 3.53 GHz . It is claimed to be the first-in-mobile Qualcomm Oryon CPU delivering 45% performance boost, 44% greater power efficiency, and the largest shared data cache. With the 7-core architecture, the Adreno GPU also is said to have achieved 40% enhanced performance and 40% improved efficiency. Throughout the system, 27% of power saving can also be experienced.

The 7-core version Snapdragon 8 Elite is also boasted as the fastest Qualcomm Hexagon NPU and with Qualcomm AI Engine, it delivers 45% AI performance improvement and 45% better performance per watt. Thanks to the Qualcomm Hexagon NPU directly fused with the brand’s AI ISP, leading camera features of the industry such as limitless semantic segmentation at 4K resolution, on-device video object eraser, and Insight AI are being offered.

On the gaming side, with Unreal Engine 5’s Nanite solution and Unreal’s Chaos Physics Engine, film-quality 3D environments in smartphone gaming with maximized efficiency and life-like object interactions and simulations even in complex scenarios are being provided. The Snapdragon Sound Technology Suite with Qualcomm aptX Lossless Technology and Qualcomm Expanded Personal Area Network (XPAN) Technology further assures up to 24-bit 48kHz Bluetooth music streaming + up to 24-bit 96kHz Wi-Fi music streaming and whole-building untethered audio coverage. Ultra-low power Wi-Fi 7 support is also a key feature.

Speaking more about the connectivity features, multi-gigabit 5G speeds are achieved with the help of the Snapdragon X80 5G Modem-RF System, dedicated AI tensor accelerator, and first 4×6 MIMO solution, along with 30% accurate location positioning. Wi-Fi ranging, Bluetooth wireless technology, and UWB proximity technologies for building access control, object tracking, and other functions are also on offer with the integrated Qualcomm FastConnect 7900 Mobile Connectivity System that is 40% more efficient.

You may check out more about the 7 core or hexa-core version of the Snapdragon 8 Elite chip below.

The post Did You Know That Qualcomm’s Snapdragon 8 Elite Chip Also has a 7-Core or Hexa-Core Version? appeared first on The Tech Outlook.

Sony Corporation has been introducing various hi-tech gadgets and innovations in order to meet the needs of customers and provide them with the best services. Yesterday the company announced the launch of one such amazing innovation- XYN^TM.

Sony Corporation announced the launch of XYN™ (/zin/), an integrated software and hardware solution designed to support the creation of spatial content.

XYN Motion Studio is a PC application which utilizes Sony’s proprietary algorithms for automatic motion interpolation and… pic.twitter.com/kmjgNp5bI3

— Sony (@Sony) January 7, 2025

What is XYN^TM?

It is an integrated software and hardware solution designed to support the creation of spatial content. This solution is said to accurately capture real-world objects, human motion, and backgrounds, recreating them in virtual environments for 3D Computer graphics production. XYN will support intuitive and efficient spatial content creation for a diverse range of creators. Through this latest technology, Sony will be collaborating with creators to develop innovative content for the future.

XYN Software And Hardware

XYN Motion Studio

It is a PC application that supports connection with 12 mocopi sensors and utilizes Sony’s proprietary algorithms for automatic motion interpolation and auto-tagging functions, which enhances the creative use of motion data. It will be available in late March 2025. The new XYN Motion Studio enhances precision through connections with 12 sensors via dedicated receivers (professional mode). The application also adds new functions for motion data, and editing, making motion capture more affordable and accessible to creators across various genres.

XYN Spatial Capture Solution

XYN’s Spatial capture solution will convert high-quality, photorealistic 3D CG assets from real-world objects and spaces using images captured by mirrorless cameras and proprietary algorithms. Additionally, a prototype for a mobile application that visualizes the shooting conditions of the mirrorless camera in real time is also under development. This will streamline the 3D CG production workflow for films, games, virtual production, and the metaverse for objects such as props, items, and spatial backgrounds.

XYN Headset

The “XYN Headset” is an immersive spatial content creation system equipped with high-quality 4K OLED microdisplays and video see-through function, optimized for intuitive creative work in spatial content creation. It will support various 3D production software, including pre-visualization and 3D character modeling, not only in the field of industrial design but also in entertainment, and a proof-of-concept experiment using the prototype is underway with Sony Pictures Animation.

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Last year, Qualcomm officially unveiled its Snapdragon X series chipsets that were said to provide a Copilot+ experience to users. Till now there were two variants in the series- Snapdragon X Elite and Snapdragon X Plus, yesterday at CES 2025, Qualcomm officially unveiled the third variant to this series- Snapdragon X which arrives as an affordable chipset.

It’s time for an upgrade…The #Snapdragon X processor is bringing intuitive on-device AI, multi-day battery life, and lightning-fast connectivity to everyday devices. #CES2025 #SnapdragonXSeries pic.twitter.com/YGfB84iVhE

— Snapdragon (@Snapdragon) January 6, 2025

This chipset is designed to deliver performance, multi-day battery life, and Copilot+ PC experiences for even more users globally.

Here are all the details about Snapdragon X

Features

This chipset utilizes the power of an 8-core Qualcomm Oryon CPU  with a peak clock speed of up to 3GHz. This is lower than the Snapdragon X Plus (up to 3.4GHz) and Snapdragon X Elite (up to 3.8GHz). It delivers up to 163% faster performance at ISO-power than its competitors. It balances performance and built-in intelligence with 45 TOPS NPU that runs Copilot+ PC experiences. The platform supports dynamic graphics ideal for creating presentations, web browsing, or streaming content. It is an ideal solution for students, freelance workers, and budget-conscious consumers.

Snapdragon is redefining compact computing with the world’s first mini desktop PC powered bythe  Snapdragon X series platform. The processor runs on a 4nm process while Qualcomm Adreno GPU offers performance up to 1.7 TFLOPS. It supports LPDDR5x RAM, WiFi 7, 5G connectivity, Bluetooth 5.4, Immersive lossless audio, and Advanced camera ISP, and is said to offer 2x longer battery life than the competition.

Native apps now include 20 of the most popular VPNs, 50 of the most popular security apps and cloud storage apps, and new music Digital Audio Workstations (DAW) and Virtual Audio Technology Instruments. It is coupled with 30MB of total cache and for display the platform supports Adreno DPU,  up to QHD+ 120Hz HDR10 support for on-device display resolution, 3 displays up to UHD 60z HDR10 and up to 5K 60 or UHD 120 for 2 displays (external display resolution). The chipset supports a peak download speed of 10Gbps and a peak upload speed of 3.5Gbps.

Availability

Devices powered by Snapdragon X are expected to be available from leading OEMs including Acer, Asus, Dell Technologies, HP, and Lenovo in early 2025 enabling Copilot+PCs in the $600 range.

The post Qualcomm Officially Unveils Snapdragon X Platform At CES 2025 appeared first on The Tech Outlook.

While it was earlier reported that TSMC is going to begin the 2nm mass production in the second half of this year in 2025 with Apple being the early adopters, recent reports have arrived pointing out that the 2nm process production capacity of TSMC has not been expanded properly, and with increasing testing demands, the mass production costs have become higher. In related news, Apple is thus likely to rely on 3nm chips for its iPhone 17 series, and use the 2nm chips for the next year’s iPhone 18 series, however, it is not yet confirmed yet and merely based on assumptions.

Moreover, TSMC late last month was reported to be conducting tests with global tech companies such as Apple, NVIDIA, and AMD, and in the meantime, Qualcomm and NVIDIA was also working with Samsung Foundry for promoting foundry manufacturer diversification. But later, a report arrived claiming that Qualcomm might plan to ditch TSMC and rely completely on Samsung for 2nm chips and it seems this is not true.

Here’s more about it.

Will Qualcomm Move Away from TSMC?

According to earlier reports (via Wccftech), Qualcomm wants its chips made using the 2nm process technology to be cheap and Apple which is TSMC’s biggest client has already reserved the 2nm mass production facility at TSMC. As TSMC has not yet taken the necessary steps to expand its production capacity effectively, and as the increasing demand is probably expected to bring the cost of mass production high as mentioned, Samsung has come into the picture for Qualcomm. Also, this was said to give Qualcomm a dedicated supplier for 2nm chips, and Samsung may likely be able to get back its business that was lost to TSMC previously because of lower management and yield ratio.

Even if TSMC’s production capacity and cost of production are an issue for tech makers, unlike what was reported, Qualcomm is not likely to depend fully on Samsung and ditch TSMC entirely, as per new reports (via Jukanlosreve). Qualcomm is reportedly never going to stop working with TSMC, and it is currently working with Samsung just to explore dual sourcing options and thereby promote foundry manufacturer diversity.

The post Qualcomm Possibly Won’t Abandon TSMC: Only Conducting Tests With Samsung to Explore Dual Sourcing Options appeared first on The Tech Outlook.

CES 2025 will be held next month and at this particular three-day event, many tech giants will be participating to showcase their latest innovations and some future plans. Like every year, Intel will be part of this event next year as well and today the company has shared a small sneak peek of the innovations and technologies that will be showcased at CES 2025.

Check out a sneak peek of what you'll see at #CES2025 🫣

Tap below to reveal what we've been working on. https://t.co/iWpCbt2KRE #StartsWithIntel #AIPC pic.twitter.com/tcxlN0rKiM

— Intel (@intel) December 23, 2024

Intel At CES 2025

Intel will showcase how it’s advancing what’s possible on the AI PC, the latest automotive innovations as the industry embraces software-defined connected electric vehicles powered by AI. AI-enabled experiences and demos will be showcased including a preview of the latest Intel Core Ultra-powered platforms. In addition, Intel’s latest software-defined vehicle solutions will be on display.

The company will also host a three-part educational series showcasing how AI is transforming personal and work experiences today and in the future.

Jack Weast, Intel Fellow and vice president of Intel Automotive will showcase how Intel’s unique combination of AI-enhanced high-performance computing, intelligent power management, and software-defined zonal controllers built on an open ecosystem enables a more sustainable, scalable, and profitable automotive future. The company will be enabling smarter cars through real-time data processing, autonomy, and enhanced power management.

Intel’s tagline for the upcoming CES 2025 event is AI Inside For a New Era. Recently it was also revealed that Intel is expected to launch 22 new Core 200 laptop CPUs at CES 2025.

The post Intel Shares A Sneak Peek On Its Innovations That Will Be Showcased At CES 2025 appeared first on The Tech Outlook.

MediaTek has announced the Dimensity 8400, introducing the first All Big Core chip design to the premium smartphone segment. The new chipset features eight Arm Cortex-A725 cores running at up to 3.25GHz, an Arm Mali-G720 GPU.

The Dimensity 8400 delivers 41% higher multi-core performance compared to the previous Dimensity 8300, while reducing peak power consumption by 44%. The Mali-G720 GPU provides 24% higher peak performance, 42% greater power efficiency than its predecessor.

For AI capabilities, the chip integrates the NPU 880 to support mainstream language models, generative AI applications. It also includes the Dimensity Agentic AI Engine (DAE), previously launched with the Dimensity 9400 flagship chip.

“MediaTek is redefining premium smartphone experiences with the Dimensity 8400, unleashing creativity with generative and agentic AI applications and taking mobile gaming even further,” said Dr. Yenchi Lee, General Manager of MediaTek’s Wireless Communications Business Unit. “Our All Big Core design, which we’ve also integrated into our flagship chips, highlights the impressive performance and efficiency that can go hand-in-hand so consumers don’t have to compromise.”

The chipset features the MediaTek Imagiq 1080 ISP with QPD remosaic technology, supports HDR recording across the entire zoom range. Its connectivity features include a 5G-A modem supporting up to 3CC-CA with speeds up to 5.17Gbps, Network Observation System (NOS) technology for network switching optimization.

Display capabilities include support for WQHD+ resolution at up to 144Hz refresh rate, dual screen functionality.

MediaTek has confirmed that smartphones powered by the Dimensity 8400 will be available in the market by the end of 2024.

The post MediaTek Dimensity 8400 with 3.25GHz Cortex-A725 CPUs, Mali-G720 GPU Announced appeared first on The Tech Outlook.

The Taiwanese semi-conductor company, MediaTek, has now announced that it will be conducting a product launch conference this month to unveil a new Dimensity chip. As per expected, the Dimensity 8400 sub-flagship chip is soon going to break its cover.

Here’s more about it.

MediaTek to Launch Dimensity 8400 on 23rd December?

Following the Dimensity 9400 flagship chip launch in October 2024, MediaTek was reportedly said to conduct its next Dimensity 8400 sub-flagship chip launch event on the 23rd of December 2024, and now it is official. Via the poster image shared, it is understood that a new Dimensity chip will be unveiled by the brand on the 23rd of December 2024 at 3:00 PM local time in China, and this is obviously the Dimensity 8400 chip itself according to recent reports.

Speaking of the expected core specs and details of the upcoming Dimensity chip, it has been pointed out to feature an octa-core architecture with all big cores and made using TSMC’s 4nm process technology. The core configuration consists of a Cortex A725 primary core with 3.25 GHz clock speed, three Cortex A725 performance cores with 3.0 GHz clock speed, and four Cortex A725 efficiency cores with 2.1 GHz clock speed.

It is also revealed to be integrated with an ARM Immortalis G720 MC7 GPU as well, clocked at 1.3 GHz. Performance wise, it is reported to sit in between Qualcomm’s Snapdragon 8 Gen 2 and Snapdragon 8 Gen 3 processors. The AnTuTu running score is also said to have reached up to 180W+ (1.8 million+) too.

After the official launch of the Dimensity 8400 chip taking place next week, we may soon hear smartphone brands starting to announce their upcoming devices that are going to be powered by this latest Dimensity chip. So far, Xiaomi is the only brand that is expected to debut a smartphone model with this chip (as per HyperOS codebase).

Stay tuned for more updates.

The post MediaTek Announces New Dimensity Chip Product Launch Conference for This Month: Dimensity 8400 Unveiling Soon appeared first on The Tech Outlook.

Yesterday Google officially unveiled a new quantum chip called Willow, which has earned a lot of appreciation in the industry. As per an official post by Sundar Pichai, more errors are reduced exponentially as more qubits are used in Willow.

We see Willow as an important step in our journey to build a useful quantum computer with practical applications in areas like drug discovery, fusion energy, battery design + more. Details here: https://t.co/dgPuXOoBSZ

— Sundar Pichai (@sundarpichai) December 9, 2024

It is revealed that in benchmark tests, Willow solved a standard computation in <5 mins that would take a leading supercomputer over 10^25 years which is far beyond the age of the universe. Willow helps in cracking a key challenge in quantum error correction that the field has pursued for almost 30 years.

Willow outperformed the Frontier supercomputer in a benchmark algorithm, marking a significant step for the company’s ambitions in quantum technology. Pichai has also mentioned that Willow is seen as an important step in building a useful quantum computer with practical applications in areas like drug discovery, fusion energy, battery design, and more.

In an official blog post, the company has also mentioned that with 105 qubits, Willow has best-in-class performance across two system benchmarks: quantum error correction and random circuit sampling.

Well, Willow not only received appreciation from users around the world but it also impressed Elon Musk as he commented “Wow” on Pichai’s post. To this Pichai replied, “We should do a quantum cluster in space with Starship one day. ”

Musk continued the conversation saying, “That will probably happen” and also mentioned the philosophy based on the Kardashev scale. This online conversation between the two grabbed great attention from the X users who then posted about their opinions in the comment section.

The post Sundar Pichai Announces Google’s Quantum Chip, Willow; Elon Musk Reacts appeared first on The Tech Outlook.

A hyperloop infrastructure that can transform the Railways experience to enable travel at airplane-like speeds is a vision thought a long time back. The execution of this vision has already started as Union Railway Minister, Ashwini Vaishnaw has yesterday officially confirmed on X platform that India’s first hyperloop test track has been completed by IIT Madras.

Watch: Bharat’s first Hyperloop test track (410 meters) completed.

👍 Team Railways, IIT-Madras’ Avishkar Hyperloop team and TuTr (incubated startup)

📍At IIT-M discovery campus, Thaiyur pic.twitter.com/jjMxkTdvAd

— Ashwini Vaishnaw (@AshwiniVaishnaw) December 5, 2024

He has also shared a video that shows the 410-mile track and has congratulated Indian Railways, IIT Madras Avishkar hyperloop team, and TuTr. This track is located on the IIT Madras campus in Thaiyur.

Confused about what exactly Hyperloop is?

Well, Hyperloop works on a technology that would use magnetic levitation in low-pressure tubes to transport people and goods at airplane-like speeds. The Hyperloop team’s central objective is the advancement and commercialization of Hyperloop technologies for high-speed, affordable, reliable, and sustainable transportation.

Reportedly the pod will carry 24-28 people at once and the vehicle will operate on a frictionless path at a very high speed. This system will provide passengers with point-to-point access and allow them to reach their destination directly and the train will also not stop between two destinations. This first Hyperloop train is said to operate between Mumbai and Pune reducing the travel time to just 25 minutes.

The post Bharat’s First Hyperloop Test Track Completed: Union Minister Ashwini Vaishnaw Shares Video appeared first on The Tech Outlook.

A new update has arrived from a tipster on the Weibo platform revealing that the mass production using TSMC’s 2nm process technology will be taking place later next year, while the third generation 3nm process technology is probably going to dominate the market during the interim period.

Read more about what has been revealed below.

TSMC – 2nm Mass Production and N3P Domination Next Year

This update comes from the tipster Digital Chat Station who notes in his Weibo post that TSMC, the Taiwanese semi-conductor manufacturing company, might be starting the mass production using 2nm process technology from later next year and it is scheduled for second half of 2025. [Apple could be the early adopters as always, as per reports.]

The same tipster also adds that the industry next year will be dominated by the brand’s N3P process technology, the third generation 3nm process technology, and it will possibly be the mainstream process used even in Qualcomm’s next generation SM8850 chip (the expected second generation chip of Snapdragon 8 Elite).

Speaking more, the tipster mentions that earlier tests have suggested that Qualcomm may likely use both Samsung’s SF2 and TSMC’s N3P technologies for its next flagship Snapdragon chip as relying on a single company would probably shoot up the price and this is what happened with the latest Snapdragon 8 Elite flagship processor. However, it is still likely that TSMC’s N3P technology may only be used. The next generation chip made using this technology is also pointed out to bring at least 20%+ performance improvement and built-in single-frame-level power consumption over this year’s chip.

Stay tuned for more updates.

The post TSMC 2nm Process Mass Production Schedule Tipped; TSMC N3P Said to Dominate Market Next Year appeared first on The Tech Outlook.